Nanotechnology scientists have developed a metallic glue that can bind metals together at room temperature. MesoGlue can bind metals to other surfaces without soldering or pressure. It could potentially change the landscape of electronics. EurekAlert reports: “MesoGlue was founded by Huang and two of his PhD students: They had a dream of a better way of sticking things together.” Those “things” are everything from a computer’s central processing unit and a printed circuit board to the glass and metal filament in a light bulb. The “way” of attaching them is, astonishingly, a glue made out of metal that sets at room temperature and requires very little pressure to seal. “It’s like welding or soldering but without the heat,” says Huang, who is professor and chair in the Department of Mechanical and Industrial Engineering. In a new paper, published in the January issue of Advanced Materials & Processes, Huang and colleagues, including Northeastern doctoral student Paul Elliott, describe their latest advances in the glue’s development. Our curiosity was piqued: Soldering with no heat? We asked Huang to elaborate. On new developments in the composition of the metallic glue: “Both ‘metal’ and ‘glue’ are familiar terms to most people, but their combination is [...]